Filled Vias, Blind/Buried Vias & Sequential Lamination
A “via” is a general term used on the industry for a “via hole” as opposed to a through-hole or component hole, where a lead for a component would normally be inserted. A “via” hole is only utilized to carry a signal to a different layer, and is highly utilized in SMT (Surface Mount Technology).
Our service includes filled, blind, buried, and sequentially laminated vias as required by design.
We have in-house capability to do an 80-90% non-conductive filled via from either the primary or secondary side of the board. This feature is perfect for designs that need better vacuum table adhesion during automated assembly, or for designs that utilize L.E.D. or photo-detection cells and require light shielding side to side.
For via-in-pad technology we utilize an outside service with the proper expertise. Via-in-pad technology yields the best quality which only highly skilled individuals with the latest specialized equipment can deliver. Since the entire integrity of a highly complicated board can hinge on the success and quality of a via-in-pad process, we inspect the product prior to and immediately after either non-conductive, or conductive via fill and planarization. Via-in-pad technology requires a minimum of a standard 10-day turn.
Blind vias are sequentially laminated in-house. Blind micro-vias that require controlled depth drilling must be examined on a case-by-case basis by our engineering crew. We do have the ability to sequentially laminate blind vias of varying depths and either side of a board. Additionally, we can do this in combination with buried vias, which are also built using sequential lamination procedures.